SD can support the TFT process using IGZO, IZO or LTPS on glass or PI substrate for OLED and micro-LED displays.
2. Metal and ITO/IZO deposition and patterning : glass wafer. Wafer PI/Glass (Mo, Al, Cu, ITO/IZO, a-Si:H, p-i-n a-Si:H)
SD can support deposition of Mo, Al, Cu, ITO, IZO, a-Si:H, p+a-Si:H, n+ a-Si:H and patterning by photolithography.
3. LTPO, a-Si:H TFT backplane for display and sensor
SD can support the TFT backplane process for display and sensors using LTPS Oxide or LTPO TFTs.
4. Micropatterning – Glass or Flexible, Minimum resolution : 1um
SD can support the micro-patterning of metal and semiconductor films down to 1 um width and spacing.
5. AMOLED, u-LED driving board
SD has AMOLED and u-LED driving technologies based on FPGA using the source drivers. Integrated gate driver and external gate drivers can be supported.
6. TFT backplane for QDLED, Micro-LED and OLED
SD can support the process of manufacturing display backplanes using Oxide, LTPS, and LTPO TFTs for QD-LED, Micro-LED, and OLED panels
Service
Model : FPA-3000 iw
i-line stepper
Substrate : 8” flat type wafer
mark-7
film thickness : 1.3um
Non uniformity : 1.5%
Model : Centura PVD(DC sputtering)
Substrate : 8” flat type wafer
공정내용: Mo, Al, Cu, IZO, ITO, IGZO
Model : AMAT P-5000
PECVD_Plasma-enhanced chemical vapor deposition
Substrate : 8” flat type wafer
공정 내용 : SiO2, SiNx, a-si, PIN
Model : AMAT P-5000
RIE_Reactive Ion Etching
Substrate : 8” flat type wafer
공정내용: SiO2, SiNx, Si, metal(Mo)
Model : DAS2000
Asher
Substrate : 8” flat type wafer
공정내용 : PR Strip
Model : DJ-833V
LP CVD
Substrate : 8” flat type wafer
공정내용 : a-si 증착
Model : DD-833V
Furnace
Substrate : 8” flat type wafer
공정내용 : N2 annealing
Model : E-1000
Implant
Substrate : 8” flat type wafer
공정내용 : ion doping